Silicon carbide wafer scribing
Description
Sapphire and Silicon Carbide scribing (683 KB)
Evana Technologies owns a patented (portfolio 
) scribing method for silicon carbide wafers. Silicon carbide is the perfect material to manufacture high power electronic devices, which find their applications in electric vehicle industry. This results in silicon carbide baser device market growth. Our scribing method offers high repeatability and good quality of the separated silicon carbide dies.
) scribing method for silicon carbide wafers. Silicon carbide is the perfect material to manufacture high power electronic devices, which find their applications in electric vehicle industry. This results in silicon carbide baser device market growth. Our scribing method offers high repeatability and good quality of the separated silicon carbide dies. Method features
- Zero kerf
- High scribing speed
- No substrate chipping
- Dicing streets can be very narrow
- No peeling of semiconductor layers
- Minimal thermal and mechanical stress
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Sapphire and Silicon Carbide scribing (683 KB)
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